IC Packaging Fair
About the exhibition
The IC Packaging Fair is a specialized exhibition focused on integrated circuit packaging technologies and solutions. It brings together professionals from the semiconductor industry to showcase the latest innovations in chip packaging, assembly, testing, and materials. The fair covers areas such as advanced packaging, wafer-level packaging, system-in-package, and 3D packaging. It serves as a platform for networking, knowledge exchange, and business development in the electronics manufacturing sector.
Before visiting, please verify the event dates and venue on the exhibition's official resources. Our website is not responsible for possible inaccuracies, changes, or postponements.
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On-site exhibition support
Turnkey support at IC Packaging Fair
Our qualified interpreter will help you communicate with exhibitors, ask the right questions, and collect the information you need for negotiations and sourcing.
The service includes:
Visit route planning
Transfer
Interpreter